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| VLMV3100 Vishay Semiconductors Bicolor SMD LED PLCC-3 FEATURES * * * * * * 19140_1 * * * * * * * * * DESCRIPTION These devices have been designed to meet the increasing demand for surface mounting technology. The package of the VLMV3100 is the PLCC-3. It consists of a lead frame which is embedded in a white thermoplast. The reflector inside this package is filled up with clear epoxy. This SMD device consists of a red and green chip. So it is possible to choose the color in one device. PRODUCT GROUP AND PACKAGE DATA * Product group: LED * Package: SMD PLCC-3 * Product series: bicolor * Angle of half intensity: 60 SMD LED with exceptional brightness Multicolored e3 Luminous intensity categorized Compatible with automatic placement equipment EIA and ICE standard package Compatible with IR reflow, vapor phase and wave soldering processes according to CECC 00802 and J-STD-020-C Available in 8 mm tape Low profile package Non-diffused lens: excellent for coupling to light pipes and backlighting Low power consumption Luminous intensity ratio in one packaging unit IVmax/IVmin 2.0 Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC Lead (Pb)-free device Preconditioning: acc. to JEDEC level 2a ESD-withstand voltage: up to 2 kV according to JESD22-A114-B APPLICATIONS * Automotive: backlighting in dashboards and switches * Telecommunication: indicator and backlighting in telephone and fax * Indicator and backlight for audio and video equipment * Indicator and backlight in office equipment * Flat backlight for LCDs, switches and symbols * General use PARTS TABLE PART VLMV3100-GS08 VLMV3100-GS18 Document Number 81347 Rev. 1.1, 13-Sep-07 COLOR, LUMINOUS INTENSITY Green/red, IV > 2.8 mcd Green/red, IV > 2.8 mcd TECHNOLOGY GaP on GaP/GaAsP on GaP GaP on GaP/GaAsP on GaP www.vishay.com 1 VLMV3100 Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS1) VLMV3100 PARAMETER Reverse voltage per diode2) DC Forward current per diode Surge forward current per diode Power dissipation per diode Junction temperature Operating temperature range Storage temperature range Thermal resistance junction/ ambient mounted on PC board (pad size > 16 mm2) TEST CONDITION IR = 10 A Tamb 60 C tp 10 s SYMBOL VR IF IFSM PV Tj Tamb Tstg RthJA VALUE 6 30 0.5 100 100 - 40 to + 100 - 40 to + 100 400 UNIT V mA A mW C C C K/W Note: 1) Tamb = 25 C unless otherwise specified 2) Driving the LED in reverse direction is suitable for a short term application OPTICAL AND ELECTRICAL CHARACTERISTICS1) VLMV3100, RED PARAMETER Luminous intensity Peak wavelength Angle of half intensity Forward voltage per diode Reverse current per diode Junction capacitance per diode Note: 1) Tamb = 25 C unless otherwise specified 2) in one packing unit I Vmax/IVmin 0.5 2) TEST CONDITION IF = 10 mA IF = 10 mA IF = 10 mA IF = 10 mA IF = 20 mA VR = 6 V VR = 0, f = 1 MHz SYMBOL IV d p VF IR Cj MIN 2.8 612 TYP. 6 MAX 625 UNIT mcd nm nm deg Dominant wavelength 635 60 2.4 15 3 10 V A pF OPTICAL AND ELECTRICAL CHARACTERISTICS1) VLMV3100, GREEN PARAMETER Luminous intensity2) Dominant wavelength Peak wavelength Angle of half intensity Forward voltage per diode Reverse current per diode Junction capacitance per diode Note: Tamb = 25 C unless otherwise specified 2) in one Packing Unit IVmax/IVmin 0.5 1) TEST CONDITION IF = 10 mA IF = 10 mA IF = 10 mA IF = 10 mA IF = 20 mA VR = 6 V VR = 0, f = 1 MHz SYMBOL IV d p VF IR Cj MIN 2.8 562 TYP. 6 MAX 575 UNIT mcd nm nm deg 565 60 2.4 15 3 10 V A pF www.vishay.com 2 Document Number 81347 Rev. 1.1, 13-Sep-07 VLMV3100 Vishay Semiconductors COLOR CLASSIFICATION GROUP MIN. 3 4 5 6 7 8 562 564 566 568 570 572 GREEN DOM. WAVELENGTH [NM] MAX. 565 567 569 571 573 575 L M Note: Luminous intensity is tested at a current pulse duration of 25 ms and an accuracy of 11 %. The above Type Numbers represent the order groups which include only a few brightness groups. Only one group will be shipped on each reel (there will be no mixing of two groups on each reel). In order to ensure availability, single brightness groups will not be orderable. In a similar manner for colors where wavelength groups are measured and binned, single wavelength groups will be shipped on any one reel. In order to ensure availability, single wavelength groups will not be orderable. K LUMINOUS INTENSITY CLASSIFICATION GROUP STANDARD H J 1 2 1 2 1 2 1 2 1 2 LIGHT INTENSITY [MCD] OPTIONAL MIN 2.8 3.55 4.5 5.6 7.1 9.0 11.2 14.0 18.0 22.4 MAX 3.55 4.5 5.6 7.1 9.0 11.2 14.0 18.0 22.4 28.0 Note: Wavelengths are tested at a current pulse duration of 25 ms and an accuracy of 1 nm. TYPICAL CHARACTERISTICS Tamb = 25 C, unless otherwise specified 60 10000 t p /T = 0.005 Tamb < 60 C 0.01 0.02 0.05 IF - Forward Current (mA) I F - Forward Current (mA) 50 40 30 20 10 0 0 20 40 60 80 100 1000 100 0.2 0.5 DC 10 0.1 1 0.01 95 9985 0.1 1 10 100 95 10905 Tamb - Ambient Temperature (C) t p - Pulse Length (ms) Figure 1. Forward Current vs. Ambient Temperature Figure 2. Pulse Forward Current vs. Pulse Duration Document Number 81347 Rev. 1.1, 13-Sep-07 www.vishay.com 3 VLMV3100 Vishay Semiconductors 0 10 20 30 IV rel - Relative Luminous Intensity 100 red I F - Forward Current (mA) 40 1.0 0.9 0.8 0.7 50 60 70 80 10 1 0.1 0.6 95 10319 0.4 0.2 0 0.2 0.4 0.6 95 9989 0 1 2 3 4 V F - Forward Voltage (V) 5 Figure 3. Rel. Luminous Intensity vs. Angular Displacement Figure 6. Forward Current vs. Forward Voltage 1.2 I V re l - Relative Luminous Intensity red I F - Forward Current (mA) 1.0 0.8 0.6 0.4 0.2 0 590 95 10040 100 green 10 1 610 630 650 670 690 0.1 0 95 9986 - Wavelength (nm) 1 2 3 4 5 V F - Forward Voltage (V) Figure 4. Relative Intensity vs. Wavelength Figure 7. Forward Current vs. Forward Voltage 1.2 IVrel - Relative Luminous Intensity green 1.0 0.8 0.6 0.4 0.2 0 520 I v rel - Relative Luminous Intensity 10 red 1 0.1 0.01 540 560 580 600 620 95 9995 1 10 I F - Forward Current (mA) 100 95 10038 - Wavelength (nm) Figure 5. Relative Intensity vs. Wavelength Figure 8. Relative Luminous Intensity vs. Forward Current www.vishay.com 4 Document Number 81347 Rev. 1.1, 13-Sep-07 VLMV3100 Vishay Semiconductors I v rel - Relative Luminous Intensity 10 2.4 IV rel - Relative Luminous Intensity green red 2.0 1.6 1.2 0.8 0.4 0 1 0.1 0.01 1 95 9996 10 100 95 10321 I F - Forward Current (mA) 10 1 20 0.5 50 0.2 100 0.1 200 0.05 500 IF (mA) 0.02 tP/T Figure 9. Relative Luminous Intensity vs. Forward Current Figure 12. Rel. Luminous Intensity vs. Forw. Current/Duty Cycle 2.0 I v rel - Specific Luminous Intensity I v rel - Relative Luminous Intensity 2.4 red 1.6 green 2.0 1.6 1.2 0.8 0.4 0 1.2 0.8 0.4 0 0 95 9993 40 60 80 Tamb - Ambient Temperature (C) 20 100 95 10263 10 1 20 0.5 50 0.2 100 0.1 200 0.05 500 0.02 IF (mA) t p /T Figure 10. Rel. Luminous Intensity vs. Ambient Temperature Figure 13. Specific Luminous Intensity vs. Forward Current 2.0 I v rel - Relative Luminous Intensity green 1.6 1.2 0.8 0.4 0 0 95 10320 20 40 60 80 100 T amb - Ambient Temperature (C) Figure 11. Rel. Luminous Intensity vs. Ambient Temperature Document Number 81347 Rev. 1.1, 13-Sep-07 www.vishay.com 5 VLMV3100 Vishay Semiconductors PACKAGE DIMENSIONS Mounting Pad Layout 2.6 (2.8) 1.2 area covered with solder resist 4 1.6 (1.9) Dimensions: IR and Vaporphase (Wave Soldering) METHOD OF TAPING/POLARITY AND TAPE AND REEL SMD LED (VLM.3 - SERIES) Vishay's LEDs in SMD packages are available in an antistatic 8 mm blister tape (in accordance with DIN IEC 40 (CO) 564) for automatic component insertion. The blister tape is a plastic strip with impressed component cavities, covered by a top tape. TAPING OF VLM.3... 3.5 3.1 2.2 2.0 4 5.75 5.25 3.6 3.4 1.85 1.65 0.5 4.0 3.6 8.3 7.7 1.6 1.4 4.1 3.9 2.05 1.95 4.1 3.9 0.25 Adhesive Tape 94 8668 Figure 14. Tape Dimensions in mm for PLCC-2 Blister Tape Component Cavity 94 8670 www.vishay.com 6 Document Number 81347 Rev. 1.1, 13-Sep-07 VLMV3100 Vishay Semiconductors REEL PACKAGE DIMENSION IN MM FOR SMD LEDS, TAPE OPTION GS08 (= 1500 PCS.) Temperature (C) 120 10.0 9.0 TTW Soldering 300 250 200 150 100 50 0 0 50 235 C...260 C first wave ca. 200 K/s 100 C...130 C 5s (acc. to CECC00802) 948626-1 Lead Temperature second wave ca. 2 K/s full line: typical dotted line: process limits 4.5 3.5 2.5 1.5 13.00 12.75 63.5 60.5 2 K/s forced cooling 100 Time (s) 150 ca. 5 K/s Identification Label: Vishay Type Group Tape Code Production Code Quantity 200 250 180 178 14.4 max. 94 8665 Figure 18. Double Wave Soldering of Opto Devices (all Packages) Figure 15. Reel Dimensions - GS08 BAR CODE PRODUCT LABEL EXAMPLE: 106 A H VISHAY REEL PACKAGE DIMENSION IN MM FOR SMD LEDS, TAPE OPTION GS18 (= 8000 PCS.) PREFERRED 120 10.4 8.4 37 4.5 3.5 2.5 1.5 13.00 12.75 62.5 60.0 B C D E F G 20164 Identification Label: Vishay Type Group Tape Code Production Code Quantity 321 329 14.4 max. 18857 Figure 16. Reel Dimensions - GS18 SOLDERING PROFILE IR Reflow Soldering Profile for lead (Pb)-free soldering Preconditioning acc. to JEDEC Level 2a A) Type of component B) Manufacturing plant C) SEL - selection code (bin): e.g.: H2 = code for luminous intensity group 3 = code for color group D) Date code year/week E) Day code (e.g. 4: Thursday) F) Batch no. G) Total quantity H) Company code DRY PACKING The reel is packed in an anti-humidity bag to protect the devices from absorbing moisture during transportation and storage. Aluminum bag 300 255 C 255C 240 C 217 C max. 260 C 245 C 250 Temperature (C) 200 max. 30 s 150 max. 120 sec max. 100 sec 100 max. Ramp Up 3 C/sec max. Ramp Down 6 C/sec 50 Label 0 50 100 150 Time (s) max. 2 cycles allowed 0 200 250 300 19470-2 Figure 17. Vishay Lead (Pb)-free Reflow Soldering Profile (acc. to J-STD-020C) Reel 15973 Document Number 81347 Rev. 1.1, 13-Sep-07 www.vishay.com 7 VLMV3100 Vishay Semiconductors FINAL PACKING The sealed reel is packed into a cardboard box. A secondary cardboard box is used for shipping purposes. RECOMMENDED METHOD OF STORAGE Dry box storage is recommended as soon as the aluminium bag has been opened to prevent moisture absorption. The following conditions should be observed, if dry boxes are not available: * Storage temperature 10 C to 30 C * Storage humidity 60 % RH max. After more than 672 h under these conditions moisture content will be too high for reflow soldering. In case of moisture absorption, the devices will recover to the former condition by drying under the following condition: 192 h at 40 C + 5 C/ - 0 C and < 5 % RH (dry air/ nitrogen) or 96 h at 60 C + 5 C and < 5 % RH for all device containers or 24 h at 100 C + 5 C not suitable for reel or tubes. An EIA JEDEC standard JESD22-A112 level 2a label is included on all dry bags. LEVEL This bag contains MOISTURE -SENSITIVE DEVICES ESD PRECAUTION Proper storage and handling procedures should be followed to prevent ESD damage to the devices especially when they are removed from the antistatic shielding bag. Electro-static sensitive devices warning labels are on the packaging. VISHAY SEMICONDUCTORS STANDARD BAR CODE LABELS The Vishay Semiconductors standard bar code labels are printed at final packing areas. The labels are on each packing unit and contain Vishay Semiconductors specific data. CAUTION 2a 1. Shelf life in sealed bag 12 months at <40C and < 90% relative humidity (RH) 2. After this bag is opened devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing (peak package body temp. 260C) must be: a) Mounted within 672 hours at factory condition of < 30C/60%RH or b) Stored at <10% RH. 3. Devices require baking before mounting if: a) Humidity Indicator Card is >10% when read at 23C + 5C or b) 2a or 2b is not met. 4. If baking is required, devices may be baked for: 192 hours at 40C + 5C/-0C and <5%RH (dry air/nitrogen) or o or 96 hours at 605 Cand <5%RH For all device containers 24 hours at 1005C Not suitable for reels or tubes Bag Seal Date: ______________________________ (If blank, see bar code label) Note: LEVEL defined by EIA JEDEC Standard JESD22-A113 19786 Example of JESD22-A112 level 2a label www.vishay.com 8 Document Number 81347 Rev. 1.1, 13-Sep-07 VLMV3100 Vishay Semiconductors OZONE DEPLETING SUBSTANCES POLICY STATEMENT It is the policy of Vishay Semiconductor GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs). The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances. We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Document Number 81347 Rev. 1.1, 13-Sep-07 www.vishay.com 9 Legal Disclaimer Notice Vishay Disclaimer All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, "Vishay"), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 18-Jul-08 www.vishay.com 1 |
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